The Haapavesi manufacturing facility offers flexible manufacturing of high-technology electronic products to meet specific client requirements. The facility has modern production lines for achieving today’s requirements regarding accuracy, productivity and versatility for placement of both through-hole (THT) and surface mound components (SMD). SMD component soldering is done using reflow or vapor phase soldering processes, THT soldering by using wave, selective or manual soldering processes.
The facility uses X-ray, Solder Paste Inspection (SPI) and 3D Automatic Optical Inspection (AOI) machines for product inspection.
For environmental stress screening of demanding products, the plant has an Environmental Stress Screening (ESS) cabinet.
For electrical testing of circuit boards, the plant is equipped with both In-Circuit and flying probe testers.
Final or sub-assembly from mechanical assembly to sales packaging.
Services
- Manufacturing of medical equipment and industrial electronics
- Highly automated production of small and middle-sized production series
- RoHS and non-RoHS manufacturing processes for no-clean and cleanable applications
- Cleaning processes and cleanliness analysis for applications requiring special cleanliness
- Visual inspection with inline 3D AOIs and X-ray
- Functional electrical testing, or In-Circuit testing using either a bed of nails test or a flying probe
- Maintenance and service support of customers’ testers
- Protection of electronics products with machine coating (UV and thermally cured) or moulding
- Rigid and rigid-flex depaneling with CNC router
- Component level traceability. PCB marking with CO2 laser
- Product and material lifecycle management services (PLM)